| Title: |
Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0 Ag–0.5 Cu lead-free solder
AA El-Daly, TA Elmosalami, WM Desoky, MG El-Shaarawy, AM Abdraboh
Materials Science and Engineering: A 618, 389-397 |
| Authors: | AA El-Daly, TA Elmosalami, WM Desoky, MG El-Shaarawy, AM Abdraboh |
| Year: | 2014 |
| Keywords: | Not Available |
| Journal: | Materials Science and Engineering: A |
| Volume: | 618 |
| Issue: | Not Available |
| Pages: | 389-397 |
| Publisher: | Elsevier |
| Local/International: | International |
| Paper Link: | Not Available |
| Full paper | Mervat Gamal El-Shaarawy_1-s2.0-S0921509314011332-main.pdf |
| Supplementary materials | Not Available |
| Abstract: |
Abstract In the present study, nano-sized ZnO particle-reinforced Sn–3.0 Ag–0.5 Cu (SAC305) composite solder was prepared by mechanically dispersing nano-particles into SAC305 solder at 900 C for 2 h. The effects of ZnO addition on microstructure, melting behavior and corresponding mechanical properties of SAC305 solder were explored. Microstructure analysis revealed that the wurtzite ZnO particles were effective in reducing both the β-Sn grain size and spacing between Ag 3 Sn and Cu 6 Sn 5 particles. The ... |
