| You are in:Home/Publications/Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0 Ag–0.5 Cu solder alloy AA El-Daly, WM Desoky, TA Elmosalami, MG El-Shaarawy, AM Abdraboh Materials & Design (2015) 65, 1196-1204 | |
Prof. Mervat Gamal El-Shaarawy :: Publications: |
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| Title: | Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0 Ag–0.5 Cu solder alloy
AA El-Daly, WM Desoky, TA Elmosalami, MG El-Shaarawy, AM Abdraboh
Materials & Design (2015) 65, 1196-1204 |
| Authors: | AA El-Daly, WM Desoky, TA Elmosalami, MG El-Shaarawy, AM Abdraboh |
| Year: | 2015 |
| Keywords: | Not Available |
| Journal: | Materials & Design |
| Volume: | 65 |
| Issue: | Not Available |
| Pages: | 1196-1204 |
| Publisher: | Elsevier |
| Local/International: | International |
| Paper Link: | Not Available |
| Full paper | Mervat Gamal El-Shaarawy_1-s2.0-S0261306914006748-main.pdf |
| Supplementary materials | Not Available |
| Abstract: |
Nano-sized SiC particles-reinforced Sn–3.0Ag–0.5Cu (SAC305) composite solder was prepared bymechanically dispersing SiC particles into plain SAC305 alloy at 900 °C for 90 min. The effects of SiC addi-tion on microstructure, melting behavior and tensile properties of as-cast SAC305 solders were system-atically investigated. The data from microstructure-properties analysis of composite solder show that thenano-sized SiC particles has significantly refined the microstructure, increased the strength and elasticmodulus in comparison with the plain SAC305 solder. In addition, SiC particles decrease the pasty rangeof composite SAC305-0.7SiC solder although the undercooling and eutectic temperature prolonged nearlyat the SAC305 level. A strain rate-dependent model of elastic modulus (E), yield stress (0.2%YS) and ulti-mate tensile strength (UTS) was developed based on the test results. The predicted tensile parameters forboth solders are reasonably close to the present experimental data |
