Cooling temperature-sensitive appliances, such as electronic components, has recently become essential in their design and development to reduce the negative effect of excessive temperature rise on performance. The current experiment focuses on passive cooling of electronic devices utilizing an innovative vapor chamber with a cylindrical cross-section that is integrated with a straight fins heat sink. Therefore, a fabricated system is attached to an electric heater to imitate the heat dissipation from electronic devices. Several experiments are conducted to investigate the effect of two working fluids (Ethyl alcohol and water), seven varied charge ratios (ranging from 20% to 65%), different system orientations (ranging from 0° to 180° in 45° intervals), and seven distinct heat load values on overall system performance. The performance of the integrated vapor chamber-straight fins (VC-SF) heat sink is then compared to those of two conventional heat sinks, a straight fins (SF) heat sink and a solid copper plate (SCP) heat sink. The results reveal that using the integrated vapor chamber-straight fins (VC-SF) heat sink significantly reduces the average front wall temperature associated with the electronic component when compared to other heat sinks, and this effect holds true throughout all operating scenarios. Furthermore, when compared to other working fluids and charging ratios, the system filled with pure water as the working fluid and a charge ratio of 25% performs better for all operating conditions. Finally, at an inclination angle of 0°, the minimal hot wall temperature associated with the electronic component's operating temperature can be reached, resulting in the greatest performance. In contrast, the highest hot wall temperature is attained at an inclination angle of 180°, regardless of the applied heat load or charging ratio. |
