This work introduces a three-dimensional analysis of an inline module composed of two thermal sources
using ANSYS-FLUENT Computational Fluid Dynamics (CFD) package. The effect of package spacing ratio
(1 S 3) on the heat transfer coefficient of the upstream (UTS) and downstream (DTS) thermal sources
within Reynolds number range of 2464 6 ReL 6 16; 430 are considered. The predictions are compared
with the experiments performed on air wind tunnel with two thermal sources mounted on its horizontal
surface within Reynolds number range of 4848 6 ReL 6 13; 635. The numerical results are compared and
validated with the experimental results and a good agreement is obtained. Compared to a single thermal
source (STS), it is observed that the reduction in the average Nusselt number of the UTS and DTS is 26.3%
and 35.6%, respectively, at S = 1. This reduction decreases to 4.9% and 12.6%, respectively, at S = 3. Finally,
the present study aims to extend the printed circuit boards designers with average Nusselt number correlations
for the UTS and DTS as a function of Reynolds number and package spacing within
2464 6 ReL 6 16; 430 and (1 S 3). |
