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Prof. Ragab Khalil Ali Khalil :: Publications:

Title:
Effect of package spacing on convective heat transfer from thermal sources mounted on a horizontal surface
Authors: R.K. Ali , H.A. Refaey, M.R. Salem
Year: 2018
Keywords: Electronic module Convective Numerical and experimental
Journal: Applied Thermal Engineering
Volume: 132
Issue: Not Available
Pages: 676–685
Publisher: ScienceDirect
Local/International: International
Paper Link:
Full paper Ragab Khalil Ali Khalil_our paper in ate.pdf
Supplementary materials Not Available
Abstract:

This work introduces a three-dimensional analysis of an inline module composed of two thermal sources using ANSYS-FLUENT Computational Fluid Dynamics (CFD) package. The effect of package spacing ratio (1  S  3) on the heat transfer coefficient of the upstream (UTS) and downstream (DTS) thermal sources within Reynolds number range of 2464 6 ReL 6 16; 430 are considered. The predictions are compared with the experiments performed on air wind tunnel with two thermal sources mounted on its horizontal surface within Reynolds number range of 4848 6 ReL 6 13; 635. The numerical results are compared and validated with the experimental results and a good agreement is obtained. Compared to a single thermal source (STS), it is observed that the reduction in the average Nusselt number of the UTS and DTS is 26.3% and 35.6%, respectively, at S = 1. This reduction decreases to 4.9% and 12.6%, respectively, at S = 3. Finally, the present study aims to extend the printed circuit boards designers with average Nusselt number correlations for the UTS and DTS as a function of Reynolds number and package spacing within 2464 6 ReL 6 16; 430 and (1  S  3).

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