| Title: | Analysis of Interface Cracks Between Bonded Bi-Material Strips for Thermal Loading, The First International Symposium on Thermal Stresses and Related Topic, ACT CITY Hamamatsu, Japan |
| Authors: | Hasebe, N. and Salama, M. |
| Year: | 1995 |
| Keywords: | Not Available |
| Journal: | Not Available |
| Volume: | Not Available |
| Issue: | Not Available |
| Pages: | Not Available |
| Publisher: | Not Available |
| Local/International: | International |
| Paper Link: | Not Available |
| Full paper | Not Available |
| Supplementary materials | Not Available |
| Abstract: |
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